Honor Honor 7X
bondModel numbers: BND-L21, BND-L22, BND-L24, BND-L31, BND-AL10, BND-AL00, BND-TL10
Specifications
- Released
- 2017
- SoC
- HiSilicon Kirin 659
- CPU
- 8 cores (arm64-v8a) — 4x 2.36 GHz Cortex-A53 + 4x 1.7 GHz Cortex-A53
- GPU
- ARM Mali-T830 MP2
- RAM
- 3 GB / 4 GB
- Storage
- 32 GB / 64 GB / 128 GB
- Display
- 5.93" 1080x2160 IPS LCD
Custom ROMs
The following custom ROM builds are available for bond:
| ROM | Status | Android | Link |
|---|---|---|---|
| Resurrection RemixOpenKirin RROS Oreo v6.0.0 treble build (2018). Rich treble-GSI scene afterwards (AOSP/LineageOS/DotOS/PE GSIs confirmed into 2020); PotatoNV free bootloader unlock covers Kirin 659. | Unofficial | 8 | Download page |
| LineageOSOpenKirin treble LOS 15.1 beta 4/5 (2018); never official LOS. | Unofficial | 8 | Download page |
| CarbonROMOpenKirin unified Kirin treble image (2018). openkirin.net is gone - build availability unverified. | Official | 8 | Download page |
Sources
Every fact on this page was verified against these references on 2026-08-26: